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FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP
FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP
FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP
FOB Price: US $200 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $260 / Piece
Min. Order: 1 Piece
- Standard: GB, EN, API650, China GB Code, JIS Code, TEMA, ASME
- Surface Treatment: Powder Coated
- Energy Source: Ultrasonic
- Material: Aluminium Profile
- Materials: Cast Copper Heating Ring
- Use: Plastic Injection Molding Machine
FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP
FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP
FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP
FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP
FOB Price: US $25 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2006+
- Manufacturing Technology: Integrated Circuits Device
- Material: Compound Semiconductor
- Model: Ntc
- Package: QFP/PFP